News

11

2023

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05

How to solve oil stains in wire cutting processing

How to solve oil stains in wire cutting processing


How to solve oil stains in wire cutting processing


The mechanical part of wire cutting machining is the foundation, and its accuracy directly affects the working accuracy of the machine tool. The mechanical system consists of a machine bed and a taper device. The bed of a machine tool is generally a box structure, which is an equipment channel for supplying various components and is closely related to the accuracy of the machine tool. The wire feeding device consists of a wire storage cylinder, a reversing device, and insulation components, with electrode wires arranged in an orderly manner on the wire storage cylinder. The wire frame of the wire feeding machine is divided into single column cantilever type and double column gantry type. The swinging type is achieved by rolling the upper and lower arms with a lever. The lubrication system is used to reduce the wear of parts and minimize power loss.

The power of wire cutting is affected by two factors:


One is the current carrying capacity of the wire, and the other is the inability to timely remove corrosive substances in the slit.
Its conductive effect consumes pulse energy, and energy utilization is a problem with cutting power sources. This current value serves as the current carrying limit for cutting molybdenum wire. Thickening can improve the current carrying capacity, and due to the limitation of discharge speed of corroded materials, short-term spark discharge without strong maintenance can also lead to the loss of molybdenum wire. It is a sharp addition, so blindly increasing the thickness of the wire and increasing the current is not advisable. The influence of wire cutting in the gap is caused by the resistance load, which will short circuit some of the energy provided to the gap through the molybdenum wire. Therefore, when the cutting material becomes thicker, this is the main cause of energy loss and wire damage. Given the two main reasons that affect processing capacity, efforts should be made to improve processing speed in the following areas:

1. In order to avoid overloading the current carrying capacity of the wire, the pulse interval should be increased accordingly to avoid excessive increase in the average current value.
2. Maintain the dielectric coefficient and strength of the coolant, maintain high spark explosion force and cleaning ability, and minimize the short circuit effect of corrosive materials on pulses.
3. Wrap the wire with water outside the gap, that is, under the drive of the wire, the water starts to accelerate, and the cleaning effect of water on the gap is strong.
4. Appropriately increase the line speed to accelerate the speed of water entering the gap, increase the water volume, and effectively discharge erosion.
5. Middle line cutting processing improves frequency conversion tracking sensitivity and improves pulse utilization.

 

Due to its versatility, manufacturers can use wire cutting for a wide range of applications. Due to its ability to cut very small workpieces, this process is often an ideal choice for producing small high-precision parts that are often too fine for other machining options. In addition, this process is cost-effective for producing small batches of products, and even if the actual product is produced in different ways, it may still be beneficial for prototype production.


It is important to remember that the wire is constantly moving during the processing and cannot be reused. Therefore, copper, brass, or other wires may be several miles long, increasing process costs. Moreover, although this process does not use any force, so it does not produce burrs and can be used for fragile items, there is definitely a possibility of thermal stress. Most wire cutting operations start with rough machining, which has a relatively fast feed rate and high dielectric constant. Continuously passing through smaller incisions reduces dielectric flow and allows the finished surface to have tolerances. The reduced dielectric current avoids wire deformation during these skimming processes.